朱翻译
我的口译实战经验（廿三）接前记者提问：在增材制造零件上实现这些饰面，你们面临的最大技术瓶颈是什么？我的快速 精准 老辣的英译：What is the biggest technical bottleneck you still face in achieving these finishes on AM parts?论坛发言人：底材的孔隙率仍然是最大的挑战。即使采用优化的打印参数，我们有时也会遇到只有在最终物理气相沉积涂层过程中才会出现的微孔。这些微孔会导致释气并破坏饰面。我们目前正在开发一种专门用于增材制造底材的专有密封剂，同时也在与粉末制造商密切合作，开发用于美学应用的固有孔隙率更低的合金。我的快速 精准 老辣的英译：Porosity in the substrate remains our biggest challenge. Even with optimized printing parameters, we sometimes encounter micro-pores that only appear during the final PVD coating. These pores cause outgassing and ruin the finish. We are developing a proprietary sealant designed specifically for AM substrates, and working closely with powder manufacturers to develop alloys with lower inherent porosity for aesthetic applications.（待续）
发布于 江苏
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